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  s p e c i f i c at i o n device name type name spec. no. d a t e approved n a m e drawn checked d w g . n o . h04 - 004 - 07b ms5d3031 1 / 12 fuji electric device technol ogy co.,ltd. checked t h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . t h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d p a r t y n o r u s e d f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x p r e s s w r i t t e n c o n s e n t o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . feb. - 26 - 07 feb. - 26 - 07 feb. - 26 - 07 silicon diode PG905C4RR ms5d3031
d w g . n o . h04 - 0 04 - 06b revised records d w g . n o . ms5d3031 2 / 12 fuji electric device technology co.,ltd. t h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . t h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d p a r t y n o r u s e d f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x p r e s s w r i t t e n c o n s e n t o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . date classi - fication ind. content applied date drawn checked approved feb. - 26 - 200 7 enactment D DDDDDD issued date
d w g . n o . d w g . n o . ms5d3031 3 / 12 h04 - 004 - 03a fuji electric device technology co.,ltd. t h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . t h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d p a r t y n o r u s e d f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x p r e s s w r i t t e n c o n s e n t o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . 1. scope this specification provides the ratings and the test requirement for fuji silicon diode PG905C4RR 2. out view , marking , molding resin , characteristics (1) out view is shown ms5d3031 9 / 12 (2) marking is show n ms5d3031 9 /1 2 it is marked to type name or abbreviated type name, polarity and lot no. (3) molding resin epoxy resin ul:v - 0 (4) characteristics is shown ms5d3031 10 /1 2 12/12 bar code label of eiaj c - 3 specification. indispen sable description items are shown as below. (1) type name (2) production code (3) quantity (4) lot (date code) (5) company code 3 . ratings 3 .1 maximum ratings (at ta=25 unless otherwise specified.) item symbol conditions ratings units repeti tive peak reverse voltage v rrm 400 v isolating voltage viso terminals - to - case,ac.1min 1500 v average output current i o 50hz square wave duty =1/2 t c = 93 20* a non - repetitive forward surge current ** i fsm sine wave, 10ms 1shot 70 a ope rating junction temperature tj 150 storage temperature t stg - 40 +150 * out put current of center tap full wave connection. ** rating per element 3.2 electrical (at ta=25 unless otherwise specified.) item symbol conditions maximum units forward vo ltage ** * v f i f = 10 a 1.5 v reverse current ** * i r v r = v rrm 500 a reverse recovery time*** trr i f =0.1a,i r =0.2a,irec=0.05a 0.05 s thermal resistance rth(j - c) junction to case 2.0 /w * * * rating per element 3 .3 mechanical charac teristics mounting torque recommended torque 0. 4 0. 6 n ? m approximate mass 6 g
d w g . n o . d w g . n o . ms5d3031 4 / 12 h04 - 004 - 03a fuji electric device technology co.,ltd. t h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . t h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d p a r t y n o r u s e d f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x p r e s s w r i t t e n c o n s e n t o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . 4 . test and inspection 4 .1 standard test condition standard test condition is ta=25 65%r.h. if judgment i s no doubt, the test condition is poss ible to test in normal condition ta=5 35 48 85%r.h. 4 .2 structure inspection it inspect with eye and measure, item 2 shall be satisfied. 4 .3 forward and reverse characteristics it inspect on the standard condition, item 3 .2 shall be satisfied. 4 .4 test test no. test items testing methods and conditions reference standard eiaj ed4701 sampling number acceptance number 1 terminal strength (tensile) pull force : 25 n f o r c e m a i n t a i n i n g d u r a t i o n : 1 0 1 s eiaj ed4701/401 method 1 5 2 terminal strength (bending) load force : 10 n number of times : 2times(90deg./time) eiaj ed4701/401 method 3 5 3 mounting strength screwing torque value:(m3) : 5 0 1 0 n ? cm eiaj ed4701/402 method 2 5 4 vibration f requency : 100hz to 2khz acceleration : 100m/s 2 sweeping time : 4min./1 cycle 4times for each x, y&z directions. eiaj ed4701/403 test code d 5 5 shock peak amplitude : 15km/s 2 duration time : 0.5ms 3time s for each x, y&z directions. eiaj ed4701/404 test code d 5 solder ability 1 solder : sn - 37pb solder temp. : 235 5 immersion time : 5 0.5 s apply to flux 5 6 solder ability 2 solder : sn - 3ag - 0.5cu solder temp. : 245 5 immersion time : 5 0.5 s apply to flux eiaj ed4701/303 test code a 5 m e c h a n i c a l t e s t 7 resistance to soldering heat s o l d e r t e m p . : 2 6 0 5 c i m m e r s i o n t i m e : 1 0 1 s number of times : 1times eiaj ed4701/302 test code a 5 (0 : 1)
d w g . n o . d w g . n o . ms5d3031 5 / 12 h04 - 004 - 03a fuji electric device technology co.,ltd. t h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . t h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d p a r t y n o r u s e d f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x p r e s s w r i t t e n c o n s e n t o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . test no. test items testing methods and conditions reference standard e iaj ed4701 sampling number acceptance number 1 high temp. storage temperature : stg max test duration : 1000h eiaj ed4701/201 22 2 low temp. storage temperature : stg min test duration : 1000h eiaj ed4701/202 22 3 temperature humidity storage temperature : 8 5 2 c r e l a t i v e h u m i d i t y : 8 5 5 % test duration : 1000h eiaj ed4701/103 test code c 22 4 temperature humidity bias t e m p e r a t u r e : 8 5 2 c r e l a t i v e h u m i d i t y : 8 5 5 % bias voltage : v rrm 0 . 8 test duration : 1000h eiaj ed4701/103 test code c 22 5 unsaturated pressurized vapor temperature : 1 3 0 2 c r e l a t i v e h u m i d i t y : 8 5 5 % vapor pressure : 23 0kpa test duration : 48 h eiaj ed4701/103 test code f 22 6 temperature cycle high temp. side : tstg max room temp. : 5 35 low temp. side : tstg min duration time : ht 30min,rt 5min lt 30min number of cycles : 100 cycles eiaj ed4701/105 22 7 thermal shock fluid : pure water(running water) high temp. side : 100+0/ - 5 c low temp. side : 0+5/ - 0 c duration t ime : ht 5min,lt 5min number of cycles : 100 cycles eiaj ed4701/307 test code a 22 8 steady state operating life t a = 2 5 5 c rated load test duration : 1000h 22 9 intermittent operating life tj=tjmax 50 3min on, 3min off test duration : 10000cy cles eiaj ed4701/106 22 e n d u r a n c e t e s t 10 high temp. reverse bias t e m p e r a t u r e : t a = 1 0 0 c bias voltage : vr=v rrm duty=1/2 test duration : 1000h eiaj ed4701/101 22 (0 : 1) i r Q usl x 5 usl : upper specification limit failure criteria v f Q usl x 1.1
d w g . n o . d w g . n o . ms5d3031 6 / 12 h04 - 004 - 03a fuji electric device technology co.,ltd. t h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . t h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d p a r t y n o r u s e d f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x p r e s s w r i t t e n c o n s e n t o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . 5 .cautions ? a lthough fuji electric is continually improving product quality and reliability, a small percentage of semiconductor products may become faulty. when using fuji electric semiconductor products in your equipment, you are requested to take adequate safety mea sures to prevent the equipment from causing physical injury, fire, or other problem in case any of the products fail. it is recommended to make your design fail - safe, flame retardant, and free of malfunction. ? the products described in this specification are intended for use in the following electronic and electrical equipment which has normal reliability requirements. ? computers ? oa equipment ? communications equipment (terminal devices) ? measurement equipment ? machine tools ? av equipment ? electrical home appliances ? personal equipment ? industrial robots etc. ? the products described in this specification are not designed or manufactured to be used in equipment or systems used under life - threatening situati ons. if you are considering using these products in the equipment listed below, first check the system construction and required reliability, and take adequate safety measures such as a backup system to prevent the equipment from malfunctioning. ? transport ation equipment (automobiles, trains, ships, etc.) ? backbone network equipment ? traffic - signal control equipment ? gas alarms, leakage gas auto breakers ? submarine repeater equipment ? burglar alarms, fire alarms, emergency equipment ? medical equi pment ? nuclear control equipment etc. ? do not use the products in this specification for equipment requiring strict reliability such as (but not limited to): ? aerospace equipment ? aeronautical equipment 6 .warnings ? the diodes should be used in products wi thin their absolute maximum rating (voltage, current, temperature, etc. ). the d iodes may be destroyed if used beyond the rating. ? the equipment containing diode s should have adequate fuses or circuit breakers to prevent the equipment from causing secondar y destruction (ex. fire, e xplosion etc ). ? use the diodes within their reliability and lifetime under certain environments or conditions. the d iodes may fail before the target lifetime of your products if used under certain reliability conditions. ? you mus t design the diodes to be operated within the specified maximum ratings (voltage, current, temperature, etc. ) to prevent possible failure or destruction of devices. ? consider the possible temperature rise not only for the junction and case, but also for t he outer leads. ? do not directly touch the leads or package of the diodes while power is supplied or during operation, to avoid electric shock and burns. ? the diodes are made of incombustible material. however, if a diode fails, it may emit smoke of flame. also, operating the d iodes near any flammable place or material may cause the d iodes to emit smoke or flame in case the d iodes become even hotter during operation. design the arrangement to prevent the spread of fire. ? the diodes should not used in an env ironment in the presence of acid, organic matter, or corrosive gas . (hydrogen sulfide, sulfurous acid gas.) ? the diodes should not used in an irradiated field since they are not radiation proof .
d w g . n o . d w g . n o . ms5d3031 7 / 12 h04 - 004 - 03a fuji electric device technology co.,ltd. t h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . t h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d p a r t y n o r u s e d f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x p r e s s w r i t t e n c o n s e n t o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . installation ? soldering involves temperatures which exceed the device storage temperature rating. to avoid device damage and to ensure reliability, observe the following guidelines from the quality assurance standard. table 1: solder temperature and duration method solder temperature duration flow 260 5 10 1 sec soldering iron 350 10 3. 5 0.5 sec ? the immersion depth of the lead should basically be up to the lead stopper and the distance should be a maximum of 1.5mm from the device. ? when flow - soldering, be careful to avoid immersing the package in the solder ba th. ? refer to the following torque reference when mounting the device on a heat sink. excess torque applied to the mounting screw causes damage to the device and weak torque will increase the thermal resistance, both of which conditions may destroy the dev ice. table 2:recommended tightening torque package style screw recommended tightening torque to - 3p f m3 0. 4 0.6 n ? m ? the heat sink should have a flatness within 30 m and roughness within 10 m. also, keep the tightening torque within the limits of this spe cification. ? improper handling may cause isolation breakdown leading to a critical accident. ? we recommend the use of thermal compound to optimize the efficiency of heat radiation. it is important to evenly apply the compound and to eliminate any air voids . storage ? the diodes must be stored at a standard temperature of 5 to 35 and relative humidity of 45 to 75%.if the storage area is very dry, a humidifier may be required. in such a case, use only deionized water or boiled water, since the chlorine in t ap water may corrode the leads. ? the diodes should not be subjected to rapid changes in temperature to avoid condensation on the surface of the diodes. therefore, store the d iodes in a place where the temperature is steady. ? the diodes should not be stored on top of each other, since this may cause excessive external force on the case. ? the diodes should not be stored with the lead terminals remaining unprocessed. rust may cause presolder ed connections to go fail during later processing. ? the diodes should be stored in antistatic containers or shipping bags.
d w g . n o . d w g . n o . ms5d3031 8 / 12 h04 - 004 - 03a fuji electric device technology co.,ltd. t h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . t h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d p a r t y n o r u s e d f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x p r e s s w r i t t e n c o n s e n t o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . 7 .appendix ? this products does not contain pbbs (polybrominated biphenyl) or pbdes (polybrominated diphenyl ether ) , substances . ? this products does not contain class - i ods and class - ii ods s ubstances set force by c l e a n a i r a c t o f u s law . ? if you have any questions about any part of this specifica tion, please contact fuji electric device technology or its sales agent before using the product ? neither fuji nor its agents shall be held liable for any injury caused by using the products not in accordance with the instructions. ? the application example s described in this specification are merely typical uses of fuji electric devicetechnology products. this specification does not confer any industrial property rights or other rights, nor constitute a license for such rights.
d w g . n o . d w g . n o . ms5d3031 9 / 12 h04 - 004 - 03a fuji electric device technology co.,ltd. t h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . t h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d p a r t y n o r u s e d f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x p r e s s w r i t t e n c o n s e n t o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . sn - cu dipping(pb 1000ppm)
d w g . n o . d w g . n o . ms5d3031 10 / 12 h04 - 004 - 03a fuji electric device technology co.,ltd. t h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . t h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d p a r t y n o r u s e d f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x p r e s s w r i t t e n c o n s e n t o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . 0.1 1 10 100 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 tj=125 tj=100 tj=25 forward characteristic (typ.) f o r w a r d c u r r e n t forward voltage 0 100 200 300 400 500 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60 reverse power dissipation (max.) square wave 180 dc r e v e r s e p o w e r d i s s i p a t i o n reverse voltage 0 2 4 6 8 10 12 14 0 2 4 6 8 10 12 14 16 18 20 dc square wave =180 sine wave =180 square wave =120 square wave =60 forward power dissipation (max.) f o r w a r d p o w e r d i s s i p a t i o n average forward current ? 360 i 0 360 vr 0 100 200 300 400 500 10 -2 10 -1 10 0 10 1 10 2 10 3 reverse characteristic (typ.) tj= 25 tj=100 tj=125 tj=150 r r e v e r s e c u r r e n t r reverse voltage
d w g . n o . d w g . n o . ms5d3031 11 / 12 h04 - 004 - 03a fuji electric device technology co.,ltd. t h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . t h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d p a r t y n o r u s e d f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x p r e s s w r i t t e n c o n s e n t o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . 0 5 10 15 20 25 30 60 70 80 90 100 110 120 130 140 150 160 170 :conduction angle of forward current for each rectifier element io:output current of center-tap full wave connection square wave =120 square wave =60 square wave =180 sine wave =180 dc current derating (io-tc) (max.) c a s e t e m p e r a t u r e average output current ? 1 10 100 10 100 1000 junction capacitance characteristic (typ.) c j j u n c t i o n c a p a c i t a n c e ( p f ) vr reverse voltage (v) 1 10 100 1 10 100 1000 surge capability (max.) f s m p e a k h a l f - w a v e c u r r e n t number of cycles at 50hz
d w g . n o . d w g . n o . ms5d3031 12 / 12 h04 - 004 - 03a fuji electric device technology co.,ltd. t h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . t h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d p a r t y n o r u s e d f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x p r e s s w r i t t e n c o n s e n t o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . 10 -3 10 -2 10 -1 10 0 10 1 10 2 10 -1 10 0 10 1 10 2 r t h j - c : 2 . 0 c / w transient thermal impedance (max.) t time (sec) t r a n s i e n t t h e r m a l i m p e d a n c e ( c / w )


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